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High-Tech-Mounting
- Placement accuracy in fine pitch range
- 0402 type series
- BGAs (Ball Grid Array), µBGA
- Multi-Chip-Module (MCM)
- Chip-Size-Packaging (CSP)
- Mounting of flexible circuit boards
- Laser-centring of electronic components
- Reflow soldering machine with reproducible controlled temperature profiles
- Nitrogen soldering machine (reflow and double-wave)
- Automatic test procedures and figure analysis
- X-ray inspection
- Boundary Scan
- Statistic evaluation programs
- Micro via technology
- Multilayer
- Circuit boards with metal core
- Ceramic substrates / hybrids
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